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Encapsulation Technologies for Electronic Applications
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated...
Hybrid Microcircuit Technology Handbook
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Thin Film Materials Technology
An invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, a key technology for nano-materials in high-speed information applications and large-area functional coating such as automotive or decorative painting of plastic parts, among other topics. In seven concise chapters, the book thoroughly reviews basic thin film technology and deposition processes, sputtering processes, structural control of compound thin films, and microfabrication by sputtering.
Ultra-Fine Particles
This book was written with several objectives in mind: 1. To share with as many scientists and engineers as possible the intriguing scientific aspects of ultra-fine particles (UFPs) and to show their potential as new materials. 2. Entice such researchers to participate in the development of this emerging field. 3. To publicize the achievements of the Ultra-Fine Particle Project, which was carried out under the auspices of the Exploratory Research for Advanced Technology program (ERATO). In addition to the members of the Ultra-Fine Particle Project, contributions from other pioneers in this field are included. To achieve the first objective described above, the uniformity of the contents and focus on a single central theme have been sacrificed somewhat to provide a broad coverage. It is expected that the reader can discover an appropriate topic for further development of new materials and basic technology by reading selected sections of this book. Alternately, one may gain an overview of this new field by reviewing the entire book, which can potentially lead to new directions in the development of UFPs.
Ultrananocrystalline Diamond
Ultrananocrystalline Diamond: Syntheses, Properties, and Applications is a unique practical reference handbook that brings together the basic science of nanoscale carbon structures, particularly its diamond phase, with detailed information on nanodiamond synthesis, properties, and applications. Here you will learn about UNCD in its two forms, as a dispersed powder made by detonation techniques and as a chemical vapor deposited film. You will also learn about the superior mechanical, tribological, transport, electrochemical, and electron emission properties of UNCD for a wide range of applications including MEMS, NEMS, surface acoustic wave (SAW) devices, electrochemical sensors, coatings for field emission arrays, photonic and RF switching, biosensors, and neural prostheses, and more. This ôEverything about Ultra-nanocrystalline Diamondö book with 16 chapters is written by leading experts worldwide. It is for everyone who researches carbon nanostructures, everyone who produces them, everyone who characterizes them, and everyone who builds devices using them.
Algorithms for VLSI Physical Design Automation
Algorithms for VLSI Physical Design Automation, Third Edition covers all aspects of physical design. The book is a core reference for graduate students and CAD professionals. For students, concepts and algorithms are presented in an intuitive manner. For CAD professionals, the material presents a balance of theory and practice. An extensive bibliography is provided which is useful for finding advanced material on a topic. At the end of each chapter, exercises are provided, which range in complexity from simple to research level. Algorithms for VLSI Physical Design Automation, Third Edition provides a comprehensive background in the principles and algorithms of VLSI physical design. The goal ...
Polymers in Organic Electronics
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is desig...
Official Gazette of the United States Patent and Trademark Office
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Integrated Circuit Packaging, Assembly and Interconnections
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
