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VLSI Design and Test for Systems Dependability
This book discusses the new roles that the VLSI (very-large-scale integration of semiconductor circuits) is taking for the safe, secure, and dependable design and operation of electronic systems. The book consists of three parts. Part I, as a general introduction to this vital topic, describes how electronic systems are designed and tested with particular emphasis on dependability engineering, where the simultaneous assessment of the detrimental outcome of failures and cost of their containment is made. This section also describes the related research project “Dependable VLSI Systems,” in which the editor and authors of the book were involved for 8 years. Part II addresses various threat...
Ultra-thin Chip Technology and Applications
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Optogenetics
This book, now in a thoroughly revised second edition, offers a comprehensive review of the rapidly growing field of optogenetics, in which light-sensing proteins are genetically engineered into cells in order to acquire information on cellular physiology in optical form or to enable control of specific network in the brain upon activation by light. Light-sensing proteins of various living organisms are now available to be exogenously expressed in neurons and other target cells both in vivo and in vitro. Cellular functions can thus be manipulated or probed by light. The new edition documents fully the extensive progress since publication of the first edition to provide an up-to-date overview...
3D Integration in VLSI Circuits
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technol...
Processing, Materials, and Integration of Damascene and 3D Interconnects
This issue focuses on recent advances in damascene interconnects and 3D interconnects.
Advances in Mechanics of Time-Dependent Materials
This book presents current trends in Mechanics of Time Dependent Materials. It covers a number of cutting-edge themes, such as characterization of linear and nonlinear mechanical behavior of viscoelastic materials and their composites, taking into consideration large deformations, low, moderate and large strain rates, as well as failure and fracture phenomena. The contributions are inspired by advanced applications in modern technologies, such as injection molding and extrusion.
