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BlackBerry For Dummies
Get the most juice out of your BlackBerry handheld! Feature-rich and complex, the BlackBerry is the number one smartphone in the corporate world is among the most popular handhelds for business users. This new and updated edition includes all the latest and greatest information on new and current BlackBerry mobile devices. Covering a range of valuable how-to topics, this helpful guide explores the BlackBerry's most useful features, techniques for getting the most out of your BlackBerry, and practical information about power usage. Covers all aspects of the number one smartphone in the corporate world—the BlackBerry Reviews managing appointments, creating a To Do list, getting online, using e-mail, and taking photos Shares navigation tips and shortcuts as well as essential applications for the BlackBerry Addresses power usage and consumption Advises on how to take advantage of the expandable memory In addition, BlackBerry For Dummies, 4th Edition explains business tools, games, and great sites that deliver what you need for your BlackBerry, when you need it.
BlackBerry Storm For Dummies
Take your smartphone by storm and learn how to maximize its performance RIM's next generation release of the BlackBerry Storm features an updated touch screen keyboard and WiFi. It's also noticeably thinner, lighter, and faster! With this updated release comes new—and more complex—features. This easy-to-understand guide provides you with valuable information to unlock the full potential for this powerful handheld. Focused on the new and exciting features of the BlackBerry Storm, this book shows you how to use the touch screen, enter and maintain your contacts, manage your appointments and meetings, create and manage your To-Do lists, and much, much more. Introduces the new WiFi capabilities of the BlackBerry Storm Shows you how to get organized with your contacts, appointments, meetings, e-mail, and more Demonstrates how to sync up with your desktop Helps you find your way by using your BlackBerry Storm as a GPS device Provides instructions for taking great photos Learn to take full advantage of everything your new BlackBerry Storm has to offer!
Advanced Thermoelectrics
This book provides an overview on nanostructured thermoelectric materials and devices, covering fundamental concepts, synthesis techniques, device contacts and stability, and potential applications, especially in waste heat recovery and solar energy conversion. The contents focus on thermoelectric devices made from nanomaterials with high thermoelectric efficiency for use in large scale to generate megawatts electricity. Covers the latest discoveries, methods, technologies in materials, contacts, modules, and systems for thermoelectricity. Addresses practical details of how to improve the efficiency and power output of a generator by optimizing contacts and electrical conductivity. Gives tips on how to realize a realistic and usable device or module with attention to large scale industry synthesis and product development. Prof. Zhifeng Ren is M. D. Anderson Professor in the Department of Physics and the Texas Center for Superconductivity at the University of Houston. Prof. Yucheng Lan is an associate professor in Morgan State University. Prof. Qinyong Zhang is a professor in the Center for Advanced Materials and Energy at Xihua University of China.
High-Entropy Materials: Theory, Experiments, and Applications
This book discusses fundamental studies involving the history, modelling, simulation, experimental work, and applications on high-entropy materials. Topics include data-driven and machine-learning approaches, additive-manufacturing techniques, computational and analytical methods, such as density functional theory and multifractal analysis, mechanical behavior, high-throughput methods, and irradiation effects. The types of high-entropy materials consist of alloys, oxides, and ceramics. The book then concludes with a discussion on potential future applications of these novel materials.
A Study of the Interfacial Stability of Ti/Al2O3, Ti3Al/Al2O3 and TiAl/Al2O3 Composite Materials
This thesis is a study of the interfacial stability of the Ti-Base metal matrix composites Ti/Al2O3, Ti3Al/Al2O3 and TiAl/Al2O3. Interfacial stability is discussed in view of the importance of thermodynamics and kinetics as the primary considerations which govern the type of stability observed. From a thermodynamics approach, the application of phase equilibrium diagrams is essential in the design of composite systems. A classification system, with reference to phase equilibrium, is used to describe the type of interfacial stability observed for the composites studied. In addition, electron-probe microanalysis, atom-probe field ion microscopy and X-ray diffraction results are used to establish Ti-Al-O phase relations for the temperature range 900-to-1250 deg C. The kinetics of interfacial stability is discussed with particular attention given to the kinetic considerations; diffusion path, phase formation sequence, steady-state layer growth and interface morphology. Kinetic results in the form of parabolic growth constants and calculated interdiffusion coefficients are presented.
Assembly and Reliability of Lead-Free Solder Joints
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
