Seems you have not registered as a member of localhost.saystem.shop!

You may have to register before you can download all our books and magazines, click the sign up button below to create a free account.

Sign up

The Future of Orthodontics
  • Language: en
  • Pages: 286

The Future of Orthodontics

description not available right now.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
  • Language: en
  • Pages: 1471

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Nanopackaging
  • Language: en
  • Pages: 553

Nanopackaging

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Experimental and Applied Mechanics, Volume 6
  • Language: en
  • Pages: 649

Experimental and Applied Mechanics, Volume 6

Experimental and Applied Mechanics represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.

Molecular Modeling and Multiscaling Issues for Electronic Material Applications
  • Language: en
  • Pages: 203

Molecular Modeling and Multiscaling Issues for Electronic Material Applications

  • Type: Book
  • -
  • Published: 2014-11-20
  • -
  • Publisher: Springer

This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.

Moisture Sensitivity of Plastic Packages of IC Devices
  • Language: en
  • Pages: 573

Moisture Sensitivity of Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Esthetics and Biomechanics in Orthodontics
  • Language: en
  • Pages: 631

Esthetics and Biomechanics in Orthodontics

Esthetics and Biomechanics in Orthodontics, 2nd Edition provides everything you need to know to successfully apply biomechanics in clinical orthodontics. This edition features new content in the areas of tooth movement, treating Class III malocclusions, skeletal anchorage, Surgery First treatment plans, and space closure. In addition to comprehensive guidance on basic biomechanic principles, this state-of-the-art reference also shows how all techniques can apply biomechanical principles to improve the force delivery, understand and prevent side effects, and achieve predictable results. - Highly regarded lead author, Dr. Ravindra Nanda, is a widely known and respected educator in the field of...

Adhesion in Microelectronics
  • Language: en
  • Pages: 293

Adhesion in Microelectronics

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Cumulated Index Medicus
  • Language: en
  • Pages: 1328

Cumulated Index Medicus

  • Type: Book
  • -
  • Published: 1996
  • -
  • Publisher: Unknown

description not available right now.

The Fundamentals and Applications of Light-Emitting Diodes
  • Language: en
  • Pages: 286

The Fundamentals and Applications of Light-Emitting Diodes

The Fundamentals and Applications of Light-Emitting Diodes: The Revolution in the Lighting Industry examines the evolution of LEDs, including a review of the luminescence process and background on solid state lighting. The book emphasizes phosphor-converted LEDs that are based on inorganic phosphors but explores different types of LEDs based on inorganic, organic, quantum dots, perovskite-structured materials, and biomaterials. A detailed description is included about the diverse applications of LEDs in fields such as lighting, displays, horticulture, biomedicine, and digital communication, as well as challenges that must be solved before using LEDs in commercial applications. Traditional li...