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Through Silicon Vias
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Nanoscale Devices
The primary aim of this book is to discuss various aspects of nanoscale device design and their applications including transport mechanism, modeling, and circuit applications. . Provides a platform for modeling and analysis of state-of-the-art devices in nanoscale regime, reviews issues related to optimizing the sub-nanometer device performance and addresses simulation aspect and/or fabrication process of devices Also, includes design problems at the end of each chapter
Nanoelectronics
Nanoelectronics: Devices, Circuits and Systems explores current and emerging trends in the field of nanoelectronics, from both a devices-to-circuits and circuits-to-systems perspective. It covers a wide spectrum and detailed discussion on the field of nanoelectronic devices, circuits and systems. This book presents an in-depth analysis and description of electron transport phenomenon at nanoscale dimensions. Both qualitative and analytical approaches are taken to explore the devices, circuit functionalities and their system applications at deep submicron and nanoscale levels. Recent devices, including FinFET, Tunnel FET, and emerging materials, including graphene, and its applications are di...
Introduction to Microelectronics to Nanoelectronics
Focussing on micro- and nanoelectronics design and technology, this book provides thorough analysis and demonstration, starting from semiconductor devices to VLSI fabrication, designing (analog and digital), on-chip interconnect modeling culminating with emerging non-silicon/ nano devices. It gives detailed description of both theoretical as well as industry standard HSPICE, Verilog, Cadence simulation based real-time modeling approach with focus on fabrication of bulk and nano-devices. Each chapter of this proposed title starts with a brief introduction of the presented topic and ends with a summary indicating the futuristic aspect including practice questions. Aimed at researchers and seni...
Nano Interconnects
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understandi...
Spacer Engineered FinFET Architectures
This book focusses on the spacer engineering aspects of novel MOS-based device–circuit co-design in sub-20nm technology node, its process complexity, variability, and reliability issues. It comprehensively explores the FinFET/tri-gate architectures with their circuit/SRAM suitability and tolerance to random statistical variations.
VLSI Design and Test
This book constitutes the refereed proceedings of the 17th International Symposium on VLSI Design and Test, VDAT 2013, held in Jaipur, India, in July 2013. The 44 papers presented were carefully reviewed and selected from 162 submissions. The papers discuss the frontiers of design and test of VLSI components, circuits and systems. They are organized in topical sections on VLSI design, testing and verification, embedded systems, emerging technology.
The Role of the Internet of Things (IoT) in Biomedical Engineering
This volume introduces the key evolving applications of IoT in the medical field for patient care delivery through the usage of smart devices. It shows how IoT opens the door to a wealth of relevant healthcare information through real-time data analysis as well as testing, providing reliable and pragmatic data that yields enhanced solutions and discovery of previously undiscovered issues. This new volume discusses IoT devices that are deployed for enabling patient health tracking, various emergency issues, smart administration of patients, etc. It looks at the problems of cardiac analysis in e-healthcare, explores the employment of smart devices aimed for different patient issues, and examines the usage of Arduino kits where the data can be transferred to the cloud for internet-based uses. The volume also considers the roles of IoT in electroencephalography (EEG) and magnetic resonance imaging (MRI), which play significant roles in biomedical applications. This book also incorporates the use of IoT applications for smart wheelchairs, telemedicine, GPS positioning of heart patients, smart administration with drug tracking, and more.
Advances in Computing and Information Technology
The international conference on Advances in Computing and Information technology (ACITY 2012) provides an excellent international forum for both academics and professionals for sharing knowledge and results in theory, methodology and applications of Computer Science and Information Technology. The Second International Conference on Advances in Computing and Information technology (ACITY 2012), held in Chennai, India, during July 13-15, 2012, covered a number of topics in all major fields of Computer Science and Information Technology including: networking and communications, network security and applications, web and internet computing, ubiquitous computing, algorithms, bioinformatics, digital image processing and pattern recognition, artificial intelligence, soft computing and applications. Upon a strength review process, a number of high-quality, presenting not only innovative ideas but also a founded evaluation and a strong argumentation of the same, were selected and collected in the present proceedings, that is composed of three different volumes.
Advances in Computer Science, Engineering and Applications
The International conference series on Computer Science, Engineering & Applications (ICCSEA) aims to bring together researchers and practitioners from academia and industry to focus on understanding computer science, engineering and applications and to establish new collaborations in these areas. The Second International Conference on Computer Science, Engineering & Applications (ICCSEA-2012), held in Delhi, India, during May 25-27, 2012 attracted many local and international delegates, presenting a balanced mixture of intellect and research both from the East and from the West. Upon a strenuous peer-review process the best submissions were selected leading to an exciting, rich and a high quality technical conference program, which featured high-impact presentations in the latest developments of various areas of computer science, engineering and applications research.
